Huizhou China Eagle Electronic Technology lnc., founded in 2000, provides a one-stop service from professional R&D to sales and manufacturing. CEE's offerings include a comprehensive suite of products such as rigid printed circuit boards (RPCB), flexible printed circuit boards (FPC), rigid-flex printed circuit boards (R-F), and flexible printed circuit assembly (FPCA). Recognized as a key high-tech enterprise under the National Torch Program, they also hold the position of Vice Chairman in the China Printed Circuit Industry Association (CPCA) and contribute as one of the industry standard setters. CEE is renowned for its advanced technology and high-quality performance within China.
CEE remains at the forefront of global market trends by consistently refining their industrial structure and strategically targeting the high-end PCB market. With years of technological advancement, deep industry expertise, and an innovative management team, CEE has developed a modern management system that seamlessly integrates R&D, production, sales, and services. Their diverse product range serves multiple sectors, including consumer electronics, network communication, automotive, advanced displays, security, industrial control, healthcare, artificial intelligence, big data, cloud computing, IoT, biometrics, wearables, smart homes, and drones.
PCB is an essential component that physically supports and connects various electronic elements. It services as a conduit for electrical interconnection, offering benefits such as high density, reliability, customizable design, and flexibility in assembly and maintenance.
PCB
• MLB (Multi-layer Board)
MLB features finer line/space, multiple layers, and smaller via holes.
Possesses a more complex structure.
Increases layout density & simplifies the challenges associated with pattern/image transfer & via hole production.
• HLC (High Layer Circuits)
Facilitates easier routing of lines, leading to shorter paths and improved data signal transmission speeds.
Primarily utilized in communications, aerospace, and medical sectors.
HLC allows for a higher assembly density and results in a smaller overall size.
• HDI (High Density Interconnect）
HDI provides superior electrical performance and signal integrity.
Enhanced reliability and thermal management.
More efficient design capabilities.
Flexible Printed Circuit Board (FPC) is a distinct type of PCB known for being lightweight, thin, and flexible. They are commonly used in devices such as mobile phones, laptops. computers, PDAs, digital cameras, and LCD screens.
FPC
Product Characteristics
FPC is flexible to bend, curl, or fold, allowing for versatile arrangement within various designs.
Meets the evolving trends of higher density, enhanced reliability, and miniaturization in electronic products.
Capable of fulfilling requirements across multiple industries, such as new energy, communications,
security, automotive, and medical fields.
Rigid Flex (R-F) combines the benefits of both rigid and flexible boards. They occupy less space and provide enhanced reliability in signal transmission, aligning with the trend towards slimmer electronic devices.
Rigid Flex (R-F)
Product Characteristics
R-F exhibits resistance to extreme temperatures, both hot and cold, and is flame-resistant. It also ensures stable chemical properties and high reliability.
The design of associated products is advantageous as it can lead to reductions in assembly time and errors, as well as enhance the service life of these products.
Adaptable to spatial constraints due to its ability to change shape. It remains foldable without compromising signal transmission functionality, allowing for a substantial reduction in both the volume and weight of the finished products.
